The development of the downstream market trend to high-voltage fuse of the industry's future development path. Promulgated by the China industry information network in 2015-2022 China high-voltage fuse assessment and the future development trend of industry market depth report points out: the downstream market in recent years, electronic products, automotive electronics and all kinds of power equipment in the field of industry, more and more high to the requirement of miniaturization, integration, so the capacitor, inductor and resistor and high-voltage fuse device the size of the electronic components is becoming more and more demanding. Surface-mount technology application is the representative of the development trend of smaller, in line with the EIA (the American association of the electronics industry standard (UL248-1/14) of high-performance components is product development direction in the future. 0603 specifications surface-mount fuse, 0402 specifications SMD fuse is currently industry focus on research and development of products. Reduce the size of the circuit protection components at the same time, its electric performance must constantly improve and optimize the: (1) low interference, when the safe operation of the circuit, protect the influence of components on the circuit operation as low as possible; Such as over-current protection components required resistance as low as possible. Present low resistance from the fuse, under the condition of equal size, its resistance is 70% lower than normal product, and patch type low resistance since the fuse more can reduce more than 80%. (2) high precision, the abnormal situation in the circuit, the protection of components to be able to react quickly.
(2) the multi-function, integration
Use of array technology, similar or different high voltage fuse on PCB components together, combination of other electronic components, even become a multiple functional electronic module, not only can make each components on printed circuit board density multiplied, make it easier to component placement, meet the requirements of size shrinking, at the same time saves the downstream producers use separate discrete component selection cost and installation cost, it is an important trend in the development of high voltage fuse industry.
(3) new material, new craft
Advanced materials and technology research and development is the key to development of new type high voltage fuse device, make the products can satisfy the markets such as small size, high performance, multi-function, modularity requirements. In optimize the traditional materials, improvement on the basis of the introduction of functional materials is one of the industry to develop new products development direction. The development of new technology is to develop new products of another industry development direction. Surface-mount technology, array technology, MLCC (chip multilayer ceramic capacitor) technology, and laser punching forming technology is a newly developed technology.
(4) intelligent
Intelligent high-voltage fuse device consists of two layers of meaning: (1) local feedback circuit protection and the overall circuit protection, when a high voltage fuse device action occurs, immediately report to the console, and the protection of integrated circuit components issued instructions, realize the overall coordination of protection function; (2) active protection, the protection is no longer just limited in terms of security, but to rise to make the circuit of the original function is not affected and the perspective of improving product reliability, so active components, chip circuit protection areas would be introduced gradually.
